Inductively Coupled Plasma Etching Systems

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Samco delivers many dedicated Inductively Coupled Plasma (ICP) etching system in research and production to meet each customer's process requirements for high-density plasma etching. Our reliable, durable and compact ICP etching system allows you to handle a variety of materials (III-V compound semiconductors (GaN, GaAs, InP), silicon, SiC, quartz, glass, dielectrics, and metals.).

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Si Deep Reactive Ion Etching Systems

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Samco was the first of Japan's semiconductor process equipment manufacturers to obtain a Bosch Process license. Using our latest patented Tornado ICP� technology and harnessing the Bosch Process, Samco's Si DRIE systems have proven effective in deep, vertical, high-speed Si deep etching for both R&D and production.

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Reactive Ion Etching Systems

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Samco offers reliable and durable Reactive Ion Etching (RIE) Systems for R&D and production customers. Benchtop compact RIE etcher is a suitable tool for academic device research and die deprocessing for IC failure analysis. Open-load RIE systems and loadlock RIE systems have wide process window for plasma etching of various materials (silicon, dielectric, compound semiconductor, metal, polymer and photoresist). Cassette loading RIE systems improve process throughput for device fabrication.

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