Plasma Enhanced CVD Systems
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology to form a thin film by generating active radicals and ions on a target substrate by turning a reactive gas into a plasma state and causing a chemical reaction on the target substrate to be deposited. It is used to deposit silicon nitride film (SiN) as a passivation film and silicon oxide film (SiO?) as an interlayer insulating film in the manufacturing process of compound semiconductors and silicon semiconductors.
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等离子体增强化学气相沉积设备 PD-2201LC
生产用途设备
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等离子体增强化学气相沉积设备 PD-220NL
紧凑型设计,具有晶片搬运腔体,适合研发用途
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等离子体增强化学气相沉积设备 PD-3800L
多片晶片处理