Plasma Enhanced CVD Systems
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology to form a thin film by generating active radicals and ions on a target substrate by turning a reactive gas into a plasma state and causing a chemical reaction on the target substrate to be deposited. It is used to deposit silicon nitride film (SiN) as a passivation film and silicon oxide film (SiO?) as an interlayer insulating film in the manufacturing process of compound semiconductors and silicon semiconductors.
Liquid Source CVD™ Systems
Samco's unique Liquid Source CVD� system uses self-bias deposition techniques and a liquid TEOS source to deposit SiO2 films with low stress, from thin films to extremely thick films (up to 100 �m).
Since our establishment in 1979, Samco has developed a wealth of dry etching expertise. Today our product line includes, open-load, loadlock, and cassette type systems for both R&D and production customers.
Inductively Coupled Plasma Etching Systems
Samco delivers many dedicated Inductively Coupled Plasma (ICP) etching system in research and production to meet each customer's process requirements for high-density plasma etching. Our reliable, durable and compact ICP etching system allows you to handle a variety of materials (III-V compound semiconductors (GaN, GaAs, InP), silicon, SiC, quartz, glass, dielectrics, and metals.).
Si Deep Reactive Ion Etching Systems
Samco was the first of Japan's semiconductor process equipment manufacturers to obtain a Bosch Process license. Using our latest patented Tornado ICP� technology and harnessing the Bosch Process, Samco's Si DRIE systems have proven effective in deep, vertical, high-speed Si deep etching for both R&D and production.
Reactive Ion Etching Systems
Samco offers reliable and durable Reactive Ion Etching (RIE) Systems for R&D and production customers. Benchtop compact RIE etcher is a suitable tool for academic device research and die deprocessing for IC failure analysis. Open-load RIE systems and loadlock RIE systems have wide process window for plasma etching of various materials (silicon, dielectric, compound semiconductor, metal, polymer and photoresist). Cassette loading RIE systems improve process throughput for device fabrication.
Dry cleaning technology that uses gases to remove organic contaminants on wafer surfaces is expected to solve problems associated with wet chemical cleaning. Samco offers plasma cleaners and UV ozone cleaners for surface treatment of plastic packages and lead-frames.
UV Ozone Cleaners
Samco's UV Ozone Cleaners use a unique combination of ultraviolet irradiation, ozone, and stage heating to gently, yet effectively, remove organic materials from a variety of substrates, including silicon, glass, compound semiconductors (GaN, SiC, GaAs, and InP), sapphire, ceramics, etc. Today our product line includes, compact benchtop and cassette type systems for both R&D and mass production customers.