• 原子层沉积设备


  • Plasma Enhanced CVD Systems

    Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology to form a thin film by generating active radicals and ions on a target substrate by turning a reactive gas into a plasma state and causing a chemical reaction on the target substrate to be deposited. It is used to deposit silicon nitride film (SiN) as a passivation film and silicon oxide film (SiO?) as an interlayer insulating film in the manufacturing process of compound semiconductors and silicon semiconductors.

  • Liquid Source CVD™ Systems

    Samco's unique Liquid Source CVD� system uses self-bias deposition techniques and a liquid TEOS source to deposit SiO2 films with low stress, from thin films to extremely thick films (up to 100 �m).


Since our establishment in 1979, Samco has developed a wealth of dry etching expertise. Today our product line includes, open-load, loadlock, and cassette type systems for both R&D and production customers.

  • Inductively Coupled Plasma Etching Systems

    Samco delivers many dedicated Inductively Coupled Plasma (ICP) etching system in research and production to meet each customer's process requirements for high-density plasma etching. Our reliable, durable and compact ICP etching system allows you to handle a variety of materials (III-V compound semiconductors (GaN, GaAs, InP), silicon, SiC, quartz, glass, dielectrics, and metals.).

  • Si Deep Reactive Ion Etching Systems

    Samco was the first of Japan's semiconductor process equipment manufacturers to obtain a Bosch Process license. Using our latest patented Tornado ICP� technology and harnessing the Bosch Process, Samco's Si DRIE systems have proven effective in deep, vertical, high-speed Si deep etching for both R&D and production.

  • Reactive Ion Etching Systems

    Samco offers reliable and durable Reactive Ion Etching (RIE) Systems for R&D and production customers. Benchtop compact RIE etcher is a suitable tool for academic device research and die deprocessing for IC failure analysis. Open-load RIE systems and loadlock RIE systems have wide process window for plasma etching of various materials (silicon, dielectric, compound semiconductor, metal, polymer and photoresist). Cassette loading RIE systems improve process throughput for device fabrication.

Surface Treatment

Dry cleaning technology that uses gases to remove organic contaminants on wafer surfaces is expected to solve problems associated with wet chemical cleaning. Samco offers plasma cleaners and UV ozone cleaners for surface treatment of plastic packages and lead-frames.

  • 清洗设备

    Samco的等离子清洗器是一种平行板系统,用于清洗样品表面的有机和无机污染物。 处理室允许用户安装多个电极架子,架子电极配置的灵活性支持从研究到大批量生产的各种产品的批量处理。

  • UV Ozone Cleaners

    Samco's UV Ozone Cleaners use a unique combination of ultraviolet irradiation, ozone, and stage heating to gently, yet effectively, remove organic materials from a variety of substrates, including silicon, glass, compound semiconductors (GaN, SiC, GaAs, and InP), sapphire, ceramics, etc. Today our product line includes, compact benchtop and cassette type systems for both R&D and mass production customers.